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2022.05.11
What Is XR? | Devices in Use/EMI Shielding & Thermal Management
As the process of DX progresses, XR devices, including AR and VR, are seeing inc...
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2022.04.26
Thermal Conductivity and Thermal Impedance | Thermal Characteristics for TIM Selection
As semiconductor packages in electronic devices become highly integrated, counte...
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2022.03.22
Radio wave absorber MICROSOBER® for a clean electromagnetic environment
In modern life, radio waves are used in a variety of devices and are indispensa...
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2022.03.02
Basics of EMI Countermeasure | Principles and Types of EMI Shielding
As the technology level of wireless communication devices such as 5G increases, ...
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2022.01.25
Thermal Management Theory--Thermal Conductivity Theories and Specific Thermal Management Methods for Thermal Design
As semiconductors and other components shrink, circuits are becoming more integr...
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2021.11.05
We're excited to be a part of CS INTERNATIONAL 2021.
We will be exhibiting our products in digital form at CS International 2021 whic...
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2021.10.25
Screen Mesh for Resin Extrusion Molding
What is resin extrusion molding? Extrusion molding is a molding method in which ...
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2021.10.13
Advanced Heat Diffusion Performance for Efficient Heat Dissipation FGHP (Fine Grid Heat Pipe)
Electronic devices are becoming faster and more sophisticated, and the heat gen...
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2021.09.13
Low-Temperature Silver nanoparticle bonding material paste with High Heat Resistance and Thermal Conductivity FlowMetal™
Modern electronic device designs generate extremely high amounts of heat, which ...
This blog showcases the concept of “Creating the Future of TWC” through the following themes.
1 New product ideas embodying the idea of “What if”
2 TWC Development Department activities
3 Messages from TWC to the world
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