The FGHP is a thermal management product designed to control the heat generated by compound semiconductor materials such as GaN (Gallium Nitride) and SiC (Silicon Carbide).
Introducing the new product concept "FGHP®."
FGHP (Fine Grid Heat Pipe®) is a heat diffuser with excellent thermal diffusion capabilities, allowing rapid and uniform dispersion of high-output, high-density heat.
In areas where unprecedented high temperatures occur locally, we believe FGHP can address heat dissipation issues for next-generation power semiconductors, laser oscillators, and other devices.
Next-generation compound semiconductors (such as GaN or SiC) offer high performance but generate high heat density during operation. Traditional heat transfer structures using copper, aluminum, or graphite alone struggle to succeed in thermal design.
As a solution, FGHP was born. It utilizes evaporative latent heat on the heated surface to extract heat from the heat source, inducing convection similar to a typhoon while instantaneously diffusing heat over a large area. Meanwhile, it reduces heat density on the heating surface by several orders of magnitude and conducts heat to heat sinks or frames. Being made of metal, it can withstand high temperatures without issue.
FGHP employs a thermal conduction method different from conventional materials. Comparative experiments with copper plates will reveal the differences.
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