Thermally Conductive Compounds
The viscoelastic paste is a form stable, fully cured silicone material that takes little to no compressive force to deform during assembly.
Thermally Conductive Gap Filler
THERM-A-GAP thermal interface materials fill air gaps between hot components and heat sinks or metal chassis.
Phase-change Thermal Interface Materials (TIM) are designed to minimize the thermal resistance between power dissipating electronic components and heat sinks.
Thermally Conductive Adhesive Tapes
Tapes are non-insulating and highly thermally conductive.
CHO-THERM material is a highly thermally conductive interface insulator designed for use where the lowest possible thermal impedance is required.
Heat spreaders are easily added by peel and stick application. They conform to non-flat surfaces for optimal thermal and mechanical performance.
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As semiconductor packages in electronic devices become highly integrated, countermeasures against heat generation have become essential. The most common means of thermal management is to transfer heat to heat dissipators, such as heat spreaders and heat sinks. A TIM (Thermal Interface Material) is essential to efficiently transfer the heat generated by semiconductor chips.
Thermal Management Theory--Thermal Conductivity Theories and Specific Thermal Management Methods for Thermal Design
As semiconductors and other components shrink, circuits are becoming more integrated. As a result, advanced functional electronic devices such as smartphones are becoming thinner and their structures are increasingly complex. The heat generated by these components may interfere not only with the reliability of products, but also with their safety. Heat management is absolutely required.
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