This viscoelastic paste is a form stable, fully cured silicone material that takes little to no compressive force to deform during assembly.
THERM-A-GAP thermal interface materials fill air gaps between hot components and heat sinks or metal chassis.
Phase-change Thermal Interface Materials (TIM) are designed to minimize the thermal resistance between power dissipating electronic components and heat sinks.
These tapes are non-insulating and highly thermally conductive.
CHO-THERM is a highly thermally conductive interface insulator designed for use where the lowest possible thermal impedance is required.
Heat spreaders can be easily added with simple peel and stick application. They conform to non-flat surfaces for optimal thermal and mechanical performance.