We provide new THERMAL solutions for GaN & SiC device application. FGHP®, FlowMetal® and HEATEX® are ideal products for compound semiconductor applications. We are happy to introduce you our products at ANGELTECH VIRTUAL LIVE III.

Media Gallery & Documents

FGHP®, World's Highest-Performance Thin Vapor Chamber

FGHP® is ideal product for small, high-power FPGAs and GPUs, and high-power compound semiconductors such as GaN and SiC.

FlowMetal® for Die-Attach use

FlowMetal® is Ag nanoparticle-based paste for Die-Attach by Low‐Temperature‐Sintering process (≧150℃/302℉). This is an ideal thermal solution for high-power compound semiconductors such as GaN and SiC.

HEATEX®, High thermal conductivity sheet

HEATEX® is the world's first Thermal Interface Material with scaly h-BN fillers arranged vertically. It achieves the highest heat transfer performance as a TIM made of boron nitride.