This group consists of 6 products.
Thermally Conductive Gap Filler
THERM-A-GAP thermal interface materials fill air gaps between hot components and heat sinks or metal chassis.
Phase-change Thermal Interface Materials (TIM) are designed to minimize the thermal resistance between power dissipating electronic components and heat sinks.
Thermally Conductive Adhesive Tapes
Tapes are non-insulating and highly thermally conductive.
Heat spreaders are easily added by peel and stick application. They conform to non-flat surfaces for optimal thermal and mechanical performance.
CHO-THERM material is a highly thermally conductive interface insulator designed for use where the lowest possible thermal impedance is required.
Thermally Conductive Compounds
The viscoelastic paste is a form stable, fully cured silicone material that takes little to no compressive force to deform during assembly.