Thermal Management Product Group

This group consists of 6 products.

  • Thermally Conductive Gap Filler

    Thermally Conductive Gap Filler

    THERM-A-GAP thermal interface materials fill air gaps between hot components and heat sinks or metal chassis.

  • Phase-change materials

    Phase-change materials

    Phase-change Thermal Interface Materials (TIM) are designed to minimize the thermal resistance between power dissipating electronic components and heat sinks.

  • Thermally Conductive Adhesive Tapes

    Thermally Conductive Adhesive Tapes

    Tapes are non-insulating and highly thermally conductive.

  • Heat Spreaders

    Heat Spreaders

    Heat spreaders are easily added by peel and stick application. They conform to non-flat surfaces for optimal thermal and mechanical performance.

  • Elastomeric Insulators

    Elastomeric Insulators

    CHO-THERM material is a highly thermally conductive interface insulator designed for use where the lowest possible thermal impedance is required.

  • Thermally Conductive Compounds

    Thermally Conductive Compounds

    The viscoelastic paste is a form stable, fully cured silicone material that takes little to no compressive force to deform during assembly.