Greetings!
Today, we are introducing TWC's newest product--FGHP®, or Fine Grid Heat Pipe®.

FGHP (Fine Grid Heat Pipe®) is a heat-dissipation device that uses superior heat-diffusion performance to quickly and evenly spread high-power, high-density heat.

We believe FGHP will solve the thermal problems of next-generation power semiconductors and laser oscillators, characterized by unprecedented high spot temperatures.

Next-generation compound semiconductors (such as GaN and SiC devices) offer superior performance, but at the cost of high heat generation at high densities, making thermal designs in conventional heat-transfer structures using copper, aluminum, or graphite difficult.

FGHP was designed to solve that problem. Latent vaporization heat on the heat-receiving surface is used to remove heat from the heat source, resulting in typhoon-like convection to instantly dissipate the heat over a wide surface. This reduces the heat density by several factors on the opposite side and transfers the heat to the heat sink and housing. The metal construction also means heat resistance is not a concern.

This product uses materials and heat transmission in completely new ways.
Watch the video below to see how our FGHP device compares against a copper plate.

(FGHP® is a registered trademark of Shikoku Instrumentation Co., Ltd.)

Click here to learn more about FGHP