We will be exhibiting our products in digital form at CS International 2021 which will be held from 9th to 10th November.

Outline of the event;

Event name: CS INTERNATIONAL 2021
Date: 9th to 10th November, 2021
Official site: https://csinternational.net/
(Our exhibition booth is virtual only.)

Our exhibits are below;

FGHP®, World's Highest-Performance Thin Vapor Chamber

World's Highest-Performance Thin Vapor Chamber. This is ideal product for small, high-power FPGAs and GPUs, and high-power compound semiconductors such as GaN and SiC.

FlowMetal®, Silver nanoparticle-based paste for Die-Attach

Ag nanoparticle-based paste for Die-Attach of high-power compound semiconductors such as GaN and SiC. Sintering process temp. is ≧150℃ (302℉) with no pressure in air-reflow-oven.