Dear Valued Customer,

We will be exhibiting our new products at CES 2021 which will be held online from January 11th to 14th, 2021.

Outline of the event;

Event name: CES 2021
Date: January 11-14, 2021 * Eastern Standard Time (EST) (January 11th will be media only access and 14th will be conference only.)
Details: Please go to CES 2021 official website Official site: https://www.ces.tech/

Our exhibits are below;

□ Fine Grid Heat Pipe® (FGHP®)

World's Highest-Performance Thin Vapor Chamber. This is ideal product for small, high-power FPGAs and GPUs, and high-power compound semiconductors such as GaN and SiC.

□ FlowMetal®

Ag nanoparticle-based paste for Die-Attach of high-power compound semiconductors such as GaN and SiC. Sintering process temp. is ≧150℃ (302℉) with no pressure in air-reflow-oven.

□ HEATEX®, Thermal Interface Material

The world's first Thermal Interface Material with scaly h-BN fillers arranged vertically. It achieves the highest heat transfer performance as a TIM made of boron nitride.

Overview of CES:

It is one of the world's largest electronic equipment trade fairs held in Las Vegas, Nevada, USA every January. CES 2021 was held online due to the spread of infectious diseases caused by the new coronavirus.

We look forward to welcoming you to our booth.